Category: hardware

DDR4 SDRAM benefits and specification

DDR4 is next generation DRAM technology for use in computers. DDR4 will arrive in computers in late 2015 when Intel Skylake processor supports it. AMD will support DDR4 in early 2016.  AMD needs to work on some new technology to fully utilize DDR4 speed. Now they lags behind Intel in RAM bandwidth utilization.

DDR3 data transfer rate range is  6.4 GB/sec to 24 GB/sec.

DDR4 data transfer rate range is 12.8 GB/sec to 25.6 GB/sec.

As you can see DDR3 can achieve data transfer rate that DDR4 promises. But in DDR4 there will be other advantages.



Hybrid Memory Cube – A revolutionary innovation in DRAM memory architecture

Hybrid Memory Cube (HMC) is a revolutionary innovation in DRAM memory architecture that sets a new standard for memory performance, power consumption and cost.

Currently DDR3 is the standard for RAM in computers used in homes and offices. After DDR3 comes the DDR4 which will arrive in 2015. DDR4 will gain popularity in 2016. By 2018 DDR4 will be used widely in most of the computers.

After DDR4 comes HMC which will revolutionize the RAM speed. This will bring a significant increase in performance of the CPU. Its not clear when will HMC come to home computers. But I guess it will be in year 2017 or 2018. Question is at that time DDR 4 will be just going mainstream and this HMC will start dethroning it. Such fast change in RAM technology is hard to bring.

DDR3 data transfer speed range from 6.4 GBps to 24 GBps.

DDR4 data transfer speed range from 12.8 GBps to 25.6GBps .

You can see that  max speed achievable by ddr3 is almost equal to max speed achievable by ddr4.

HMC data transfer speed starts from 160 GBps to 320 GBps. Can even go much higher. With such high speed RAM, integrated graphics in Intel and AMD can gain huge performance increase.

  • HMC Combines high-speed logic process technology with a stack of through-silicon-via (TSV) bonded memory die.
  • HMC delivers dramatic improvements in performance, breaking through the memory wall and enabling dramatic performance and bandwidth improvements – a single HMC can provide more than 15x the performance of a DDR3 module.
  • The revolutionary architecture of HMC is exponentially more efficient than current memory, utilizing 70% less energy per bit than DDR3 DRAM technologies..
  • Hybrid Memory Cube’s increased density per bit and reduced form factor contribute to lower total cost of ownership, by allowing more memory into each machine and using nearly 90% less space than today’s RDIMMs.
With performance levels that break through the memory wall, Hybrid Memory Cube represents the key to extending network system performance to push through the challenges of new 100G and 400G infrastructure growth.  Eventually, HMC will drive exascale CPU system performance growth for next generation HPC systems.
  • Whereas DDR4 represents an evolutionary standard, HMC is a revolutionary technology that is a complete paradigm shift from current memory architectures.
  • Hybrid Memory Cube will redefine memory. By advancing past the traditional DRAM system, HMC is setting a new standard of memory that can keep up with the advancements of CPUs and GPUs.
  • Hybrid Memory Cube could be an absolute game changer for applications ranging from high performance computing to consumer technologies like tablets and graphics cards that value a combination of form factor, energy and bandwidth.